By John H. Lau ... [et al.]

ISBN-10: 0071626239

ISBN-13: 9780071626231

ISBN-10: 0071627928

ISBN-13: 9780071627924

ISBN-10: 0071741836

ISBN-13: 9780071741835

ISBN-10: 1615831592

ISBN-13: 9781615831593

Creation to MEMS --
Advanced MEMS packaging --
Enabling applied sciences for complicated MEMS packaging --
Advanced MEMS wafer-level packaging --
Optical MEMS packaging : communications --
Optical MEMS packaging : bubble change --
Optical MEMS : microbolometer packaging --
Bio-MEMS packaging --
Biosensor packaging --
Accelerometer packaging --
Radiofrequency MEMS switches --
RF MEMS tunable capacitors and tubable band-pass filters --
Advanced packaging of RF MEMS units

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Additional resources for Advanced MEMS packaging

Sample text

46. “Methods for depositing, releasing and packaging microelectromechanical devices on wafer substrates,” Patel, Satayadev R. (US), Huibers, Andrew G. (US) (+8), US2008096313 (A1)—2008-04-24. 47. “Package structure and packaging method of MEMS microphone,” Chen, Jung-Tai (TW), Chu, Chun-Hsun (TW), US2008083960 (A1)—2008-04-10. 48. “Laser assisted system and method for bonding of surfaces,” Wang, Changhai (GB), Hand, Duncan (GB) (+1), EP1907160 (A1)—2008-04-09. 49. “Method for preparing spherical glass micro-cavity used for MEMS disc type packaging,” Shang, Jintang (CN), Huang, Qingan (CN) (+2), CN101143702 (A)—2008-03-19.

US), EP1997128 (A2)—2008-12-03. 27 28 Chapter One 13. “Silicon microphone with improved structure,” Wang, Xianbin (CN), Dang, Maoqiang (CN) (+2), CN201138866 (Y)—2008-10-22. 14. “Package and packaging assembly of microelectromechanical sysyem microphone,” Huang, Chao-Ta (TW), Chien, Hsin-Tang (TW), US2008283988 (A1)—2008-11-20. 15. “Package and packaging assembly of microelectromechanical sysyem microphone,” Huang, Chao-Ta (TW), Chien, Hsin-Tang (TW), US2008283942 (A1)—2008-11-20. 16. “Capacitance type micro-accelerometer,” Liu, Minjie (CN), Liu, Yunfeng (CN) (+2), CN101271125 (A)—2008-09-24.

30. “Package and method for making the same,” Wang, MengJen (TW), US2008185706 (A1)—2008-08-07. 31. “Methods and systems for wafer level packaging of MEMS structures,” Yang, Xiao (US), Payne, Justin (US) (+3), WO2008085779 (A1)—2008-07-17. 32. “Design of MEMS packaging,” Kvisteroy, Terje (NO), Westby, Eskild (NO), US2008164546 (A1)—2008-07-10. 33. “Packaging structure and method of a MEMS microphone,” Hsiao, Wei-Min (TW), US2008166000 (A1)—2008-07-10. 34. “MEMS packaging with reduced mechanical strain,” Kvisteroy, Terje (NO), Westby, Eskild (NO), EP1944266 (A1)—2008-07-16.

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Advanced MEMS packaging by John H. Lau ... [et al.]


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